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Packaging

IC*'s are made from large thin slices (the actual chips) of silicon which are etched and cut in small pieces and then packaged in all kinds of housings with generally a lot of tiny feet sticking out on all sides.
The earliest and still very commen form is the DIP (Dual* in Line Package) which is also for humans very easy to handle. Later packaging forms have all kinds of advantages like being cheaper per pin, wasting less PCB area, being more easily handled by pick and place machines etc.
This page is about all these kinds of packages.

Term	Explanation	More
www.flipchip.com/	FlipChip Technologies
www.imaps.org/	IMAPS: International Microelectronics And Packaging Society

Addison Engineering

Addison Engineering, Inc.
tel: +1-408-956-5117
add.eng@ix.netcom.com

We are a distributor of ceramic packages, combo lids, etc.
Should you have any excess inventories or are in need of any materials please contact me.

Package abbreviations

Click on the first letter of the chip packages you're looking for:

# A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Click on the first letter of the chip packages you're looking for:
#	A	B	C	D	E	F	G	H	I	J	K	L	M	N	O	P	Q	R	S	T	U	V	W	X	Y	Z

There is more packaging information at the bottom of this page

A

B

Term	Explanation	More
BBUL	Bumpless Build-Up Layer	200110: New packaging design by Intel allowing clock speeds of upto 20 GHz.
BGA	Ball Grid Array (No pins, just solder balls on their underside.)	data
BQFP	Bumpered Quad* Flat Package
BQFPH	Bumpered Quad* Flat Package with Heat spreader

C

Term	Explanation	More
CBGA	Ceramic Ball Grid Array
CCC	Ceramic (leadless) Chip Carrier
CDIP	Ceramic Dual* In-line Package	data
CERQUAD	CERamic QUAD in-line package
CLCC	Ceramic Leadless Chip Carrier
CMPAK	Compact Mini PAcKage	Hitachi diode
CMPAK	Compact Mini PAcKage	Hitachi transistor
CPGA	Ceramic Pin Grid Array	data
CSP	Chip Size (or Scale?) Package
CerDIP	CERamic Dual* In-line Package
CerPack	CERamic flatPACK

D

Term	Explanation	More
DFP	Dual* Flat Package
DIL	Dual* In-Line (8,14,16,18,20,22,24,28,32,40,48)
DIMM	Dual* In-line Memory Module	data
DIP	Dual* In-line Package	data
DPAK	Deca-Watt Package	Hitachi transistor
DSO	Dual* Small Outline package	data

E

Term	Explanation	More
EBGA	Enhanced Ball Grid Array
ERP	Extremely small Resin Package	Hitachi diode

F

Term	Explanation	More
FC	Flip Chip
FC-PGA	Flip Chip Pin Grid Array	Intel term
FPAK	Flat PAcKage	Hitachi diode
FPBGA	Fine Pitch Ball Grid Array
FPQFP	Fine Pitch Quad* Flat Package
FPT	Fine Pitch Technology
FQFP	Fine Pitch Quad* Flat Package	data

G

H

Term	Explanation	More
HDPAK	Huge Deca-watt PAcKage	Hitachi transistor
HQFI	Heat sinked QFI
HQFP	Heat sinked QFP
HQSOP	Hermetic QSOP (20,24)
HSOI	Heat sinked SOI
HSOJ	Heat sinked SOJ
HSOP	Heat sinked SOP

I

J

Term	Explanation	More
JEDEC	See also below
JEDEC MO-161	Module	data

K

L

Term	Explanation	More
LCBGA	Low Cost Ball Grid Array
LCC	Leadless Chip Carrier or Leadless Ceramic Carrier	data
LCCC	Leadless Ceramic Chip Carrier
LDPAK	Large Deca-watt PAcKage	Hitachi diode
LFBGA	Unknown	data
LGA	Land Grid Array
LLD	LeadLess Diode	Hitachi diode
LQFP	Low profile QFP	data
LRP	Large Resin Package	Hitachi diode
L-SIM	Single In-line Memory (Module)	data
L-DIM	Dual* In-line Memory (Module)	data

M

Term	Explanation	More
MCM	Multi Chip Module
MELF	Metal ELectrode Face
Micro-PGA	Micro Pin Grid Array	Intel term
Micro-X	Unknown	data
MMW	Milli Meter Wave
MOP	Mini Oct-Lead Package	Hitachi transistor
MPAK	Mini PAcKage	Hitachi transistor
MQFP	Metric Quad* Flat Package	data
MQFP2	Metric Quad* Flat Package with heat sink
MQFPH	Metric Quad* Flat Package with Heat spreader
MQUAD	Metric QUAD flat package	data

N

O

Term	Explanation	More
OLGA	Organic Land Grid Array (Intel term) which uses Controlled Collapse Chip Connection (C4)

P

Term	Explanation	More
PBGA	Plastic Ball Grid Array
PDIL	Plastic Dual* In-Line package
PDIP	Plastic Dual* In-Line Package	data
PDIP-6-3	Plastic Dual* In-Line Package	data
PGA	Pin Grid Array	plastic	ceramic
PLCC	Plastic Leaded Chip Carrier (20,28,32,44,52,68,84)
PLCCH	Plastic Leaded Chip Carrier with Heat spreader
PLGA	Plastic Land Grid Array	Intel term
PPGA	Plastic Pin Grid Array	data
PQ2	Power Quad* flat package type 2
PQFP	Plastic Quad* Flat Package
PSO	Plastic Small Outline package

Q

Term	Explanation	More
QFI	Quad* Flat I-leaded package
QFJ	Quad* Flat J-leaded package
QFN	Quad* Flat Non-leaded package
QFP	Quad* Flat Package (44S10,44S14,48S10,64REC,80REC,100REC,120,128,160)	data
QIL	Quad* In-Line package
QIP	Quad* In-line Package
QSOP	Quarter Size Outline Package (16,20,24,28) or Quality Small Outline Package
QTCP	Quad* Tape Carrier Package
QUAD	QUAD in-line package
QUIL	QUad In-Line package
QUIP	QUad In-line Package

R

S

Term	Explanation	More
S-DIP	Shrink DIP
SD*	Side-brazed ceramic Dual* in-line package
SDIP	Shrink Dual* In-line Package	data
SECC	Single Edge Cartridge Connector	Intel term
SGA	Solder Grid Array
SHRDIL	SHRink Dual* In-Line (20,24,32,42,52,64)
SIL	Single In-Line (9,13,17)
SIMM	Single In-line Memory Module	data
SIP	Single In-line Package
SIP	Single In-line Package	data
SMC	Surface Mount Ceramic Capacitor
SME	Surface Mount Electrolytic Capacitor
SMR	Surface Mount Resistor
SMT	Surface Mount Transistor
SMTA	Surface Mount Tantalum Capacitor
SMPAK	Super Mini Package	Hitachi transistor
SO	Small Outline (8,14,16,20,24,28,32,28)
SOD	Small Outline Diode	data
SO-DIMM	Small Outline Dual* In-line Memory Module (?)	data
SOG	Small Outline IC* with Gull-wing leads
SOI	Small Outline I-leaded package
SOIC	Small Outline Integrated Circuit (same as SO)
SOJ	Small Outline J-leaded package	data
SONB	Small Outline Narrow-Body IC* with gull-wing leads
SONQFN	Small Outline Non-Leaded Package
SOP	Small Outline Package
SOP	Small Outline Package
SOT*	Small Outline Transistor	data
SP-10	Single in line Package 10 pin	Hitachi transistor
SP-12	Single in line Package 12 pin	Hitachi diode
SPAK	Small PAcKage	Hitachi transistor
SQFP	Shrink Quad* Flat Pack (32,48,64,80,208,240)
SQFP2	Shrink Quad* Flat Package with heat sink
SQFPH	Shrink Quad* Flat Package with Heat spreader
SRP	Small Resin Package	Hitachi diode
SSO	Single Small Outline package	data
SSOP	Small Shrink Outline Package (20,24,28,48,56)	data
SSP	Super Small resin Package	Hitachi diode

T

Term	Explanation	More
TAB	Tape Automated Bonding
TBGA	Tape Ball Grid Array package
TCCN	Unknown	data
TCP	Tape Carrier Package
TD	Top-brazed ceramic Dual* in-line package
TFBGA	Unknown	data
TO	Transistor single Outline package or Through-Hole Transistor	data
TO92	Unknown	data
TO218	Unknown	data
TO220	Unknown	data
TO247	Unknown	data
TO251	Unknown	data
TO252	Unknown	data
TO262	Unknown	data
TO263	Unknown	data
TO92	Unknown	data
TQFP	Thin Quad* Flat Package	data
TQFP2	Thin Quad* Flat Package with heat sink
TQFPT	Thin Quad* Flat Package with 1.0 mm body Thickness
TSOP	Thin Small Outline Package	data
TSOPII	Thin Small Outline Package type II	data
TSQFP	Thin Shrink Quad* Flat Pack (44,64,100)
TSSOP	Thin Shrink Small Outline Package (20,24,28,48,56)	data

U

Term	Explanation	More
UMD	Ultra Mini Diode	Hitachi transistor
UPAK	Uni-Watt Package	Hitachi diode
URP	Ultra small Resin Package	Hitachi transistor

V

Term	Explanation	More
VQFN	Unknown	data
VQFP	Very small Quad* Flat Package
VSO	Very Small Outline (40,56)
VSOP	Very Small Outline Package
VTQFP	Very Thin Quad* Flat Package
VTSOP	Very Thin Small Outline Package

W

X

Y

Z

Term	Explanation	More
ZIF	Zero Insertion Force
ZIP	Zigzag In-line Package

µ

Term	Explanation	More
µBGA	Micro Ball Grid Array

Some more ceramic packages

I don't know the correct abbreviations yet.

More ceramic packages:

Cans
Cequad
Cequad Lids
Ceramic Combo Lids
Ceramic Pin Grid Array
Cerpacs
Combo Lids
Flat Packages
Headers
Hybrid
J-Bend Leaded Chip Carriers
Leadless Chip Carriers
Side braze packages

(These are all distributed by Spectrum Semiconductor Materials, www.spectrum-semiconductor.com/).

More information about packaging

For a lot of information get the Hitachi CDROM!

Other types of packaging:

Four-directional type
Four-directional type Shrink package
Gull wing lead package
I-lead package
J-lead package
Non-lead package Insertion type
Surface mount type DO-41 Mod.
Surface mount type IC* Package
Two-directional type
Two-directional type Standard package

ED standards

These seem to be from:

JEDEC Standards
and/or:
Publication 95 (Registered Standard Package of Semiconductor Devices)

Spec	Formulated	Name	Abbrev
ED-7400		Standard package outline drawings of semiconductor devices (integrated circuits)
ED-7400-1		Standard package outline drawings of semiconductor devices (integrated circuits)
ED-7402-1	198902	Small outline package	SOP
ED-7402-2	199002	Shrink small outline package	SSOP
ED-7402-3	199104	Thin small outline package (Type I)	TSOP (I)
ED-7402-4	199002	Thin small outline package (Type II)	TSOP (II)
ED-7403-1	198804	Plastic dual in-line package
ED-7404	199001	Quad* Flat package	QFP
ED-7404-1	198901	Quad* flat package (fine pitch)
ED-7405-1	199003	Shrink zigzag in-line package	SZIP
ED-7406	198805	Small outline J-leaded package	SOJ
ED-7407	198806	Quad* Flat J-leaded package	QFJ
ED-7408	198810	Pin grid array package	PGA
ED-7409	198806	Quad* Flat I-leaded package	QFI
ED-7410	198806	Small outline I-leaded package	SOI
ED-7411	198902	Package names and codes
ED-7412	198811	Quad* Flat leadless package	QFN
ED-7413	198901	Single in-line package	SIP
ED-7414	198911	Guard ring quad Flat package	GQFP
ED-7415	198911	Heat sink equipped small outline package	HSOP
ED-7417	199002	Bumpered quad Flat package	BQFP
ED-7418	199007	Glass shield quad Flat package	QFP-G
ED-7419	199009	Glass shield dual in-line package	DIP-G
ED-7500		Standard package outline for semiconductor devices (Discrete devices)

IEC (International Electrotechnical Commission) standards

IEC Publication 148	Character Symbols for Discrete Devices and Integrated Circuits
IEC Publication 191	Package outline of Discrete Devices and Integrated Circuits
IEC Publication 747	Methods of Determining Ratings and Characteristics of Semiconductors
IEC Publication 286.3	Methods of Packaging Components in Automated Mounting

Other packaging info

www.klsi.com/package.html - Package Lineup

Conversion tables

Conversion tables for pin functions between DIP8..24 and PLCC20/28 packages, according to Motorola.

DIP8 1 2 3 4 5 6 7 8

DIP14 1 2 3 4 5 6 7 8 9 10 11 12 13 14

DIP16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

DIP20 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

PLCC20 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

DIP24 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

PLCC28 2 3 4 5 6 7 9 10 11 12 13 14 16 17 18 19 20 21 23 24 25 26 27 28

Makers of packages

local	Makers of sockets and packages
www.practicalcomponents.com/	Makes dummy components to practice with

Tube quantity

Standard IC* tube quantity by pin count and package type.
According to Mitel.

Pins PLADIP PLCC SOIC CERDIP LCC SIDEBRA SSOP

8 50 50

16 25 46 24

18 21 41 20

20 18 37 19 68

22 17 17

24 15 31 15 47 60

28 13 39 27 13 42 12 48

40 9 ? ?

44 27 29

68 19

www.infineon.com/cgi/ecrm.dll/ecrm/scripts/pack_cat.jsp	At Infineon
www.infineon.com/cgi/ecrm.dll/ecrm/scripts/pack_cat.jsp?oid=-8802	Power modules at Infineon
elmfg.calpoly.edu/ime157/Supplemental/IC_Abbrev/	The same list as above but with links to images of the packages.
www.maxim-ic.com/TechSupport/PackInfo.htm	A nice overview with technical drawings at Maxim's
www.temic-semi.de/pdf/packages.pdf	Package information at Temic
developer.intel.com/technology/itj/q32000/articles/art_1.htm	Article about Intel CPU packages