| C |
Ceramic Dual-in-Line (Cerdip) |
| D |
Ceramic Dual-in-Line (Side-braze) |
| E |
Plastic Dual-in-Line |
| F |
Thin Quad* Flat Package (TQFP) |
| H |
Die in Tray-Pack |
| J |
Ceramic J-Lead Quad* |
| K |
Plastic Quad* Flat Package (PQFP-EIAJ) |
| L |
Plastic Quad* Flat Package-JEDEC (PQFP-JEDEC) |
| M |
Plastic Quad* Flat Package (PQFP)-Non-JEDEC |
| N |
Small Shrink Outline Package (SSOP) |
| P |
Plastic J-Lead Chip Carrier |
| R |
Tape & Reel (for P & S Package Suffix Types Only) |
| S |
Small Outline Integrated Circuit (SOIC) |
| T |
Thin Small Shrink Outline Package (TSSOP) |
| W |
Probed Die On Wafer |
| Y |
Ceramic Leadless Chip Carrier |
